Kivilahti, J. K.: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests

T. Laurila, T. Mattila, V. Vuorinen, J. Karppinen, J. Li, M. Sippola, J.K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.53 MB

english, 2007

2

On the effects of temperature on the drop reliability of electronic component boards

T.T. Mattila, Jue Li, J.K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.64 MB

english, 2012

3

Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects

Immonen, M., Karppinen, M., Kivilahti, J.K.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.72 MB

english, 2005

4

Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions

Mattila, Toni T., Marjamaki, Pekka, Kivilahti, Jorma K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 2.51 MB

english, 2006

5

Interconnections based on Bi-coated SnAg solder balls

Korhonen, T.-M., Vuorinen, V., Kivilahti, J.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 287 KB

english, 2001

6

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Effect of Temperature on the Drop Reliability of Wafer-Level Chip Scale Packaged Electronics Assemblies

Mattila, T. T., James, R. J., Nguyen, L., Kivilahti, J. K.

Year:

2007

Language:

english

File:

PDF, 4.31 MB

english, 2007

7

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

Reinikainen, T., Poech, M., Krumm, M., Kivilahti, J.

Journal:

Journal of Electronic Packaging

Year:

1998

Language:

english

File:

PDF, 879 KB

english, 1998

8

On the implicit integration of rate-dependent inelastic constitutive models

Reijo Kouhia, Pekka Marjamäki, Jorma Kivilahti

Journal:

International Journal for Numerical Methods in Engineering

Year:

2005

Language:

english

File:

PDF, 343 KB

english, 2005

9

Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface

Markus P.K Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K Kivilahti

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 604 KB

english, 2004

10

Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate

Tuomas F. Waris, Markus P.K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 475 KB

english, 2005

11

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers

T. Laurila, J. Hurtig, V. Vuorinen, J.K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 656 KB

english, 2009

12

Interfacial reactions between lead-free solders and common base materials

T. Laurila, V. Vuorinen, J.K. Kivilahti

Journal:

Materials Science and Engineering: R: Reports

Year:

2005

Language:

english

File:

PDF, 2.82 MB

english, 2005

13

The Chemical Modeling of Electronic Materials and Interconnections

J. K. Kivilahti

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2002

Language:

english

File:

PDF, 788 KB

english, 2002

14

Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards

Marika P. Immonen, Mikko Karppinen, Jorma K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.00 MB

english, 2007

15

A novel impact test system for more efficient reliability testing

Jussi Hokka, Toni T. Mattila, Jue Li, Jarmo Teeri, Jorma. K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.89 MB

english, 2010

16

Tantalum carbide and nitride diffusion barriers for Cu metallisation

T Laurila, K Zeng, J.K Kivilahti, J Molarius, T Riekkinen, I Suni

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 723 KB

english, 2002

17

Thermodynamic and kinetic study of diffusion paths in the system Cu-Fe-Ni

K. J. Rönkä, A. A. Kodentsov, P. J. J. Van Loon, J. K. Kivilahti, F. J. J. Van Loo

Journal:

Metallurgical and Materials Transactions A

Year:

1996

Language:

english

File:

PDF, 1.25 MB

english, 1996

18

The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading

Mattila, T.T., Kivilahti, J.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 7.52 MB

english, 2010

19

Effect of 0.5 wt % Cu in Sn−3.5%Ag Solder Balls on the Solid State Interfacial Reaction with Au/Ni/Cu Bond Pads for Ball Grid Array (BGA) Applications

Alam, M. O., Chan, Y. C., Tu, K. N., Kivilahti, J. K.

Journal:

Chemistry of Materials

Year:

2005

Language:

english

File:

PDF, 736 KB

english, 2005

20

A low temperature interconnection method for electronics assembly

Kulojarvi, K., Kivilahti, J.K.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1998

Language:

english

File:

PDF, 353 KB

english, 1998

21

Nucleation Kinetics and Solidification Temperatures of SnAgCu Interconnections During Reflow Process

Yu, Hao, Kivilahti, Jorma K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 534 KB

english, 2006

22

Computational Assessment of the Effects of Temperature on Wafer-Level Component Boards in Drop Tests

Jue Li,, Mattila, T.T., Kivilahti, J.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 1004 KB

english, 2009

23

Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests

Jue Li,, Karppinen, J., Laurila, T., Kivilahti, J.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 1.27 MB

english, 2009

24

Thermal Simulation of the Solidification of Lead-Free Solder Interconnections

Yu, H., Mattila, T.T., Kivilahti, J.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 1.95 MB

english, 2006

25

Modeling joining materials for microelectronics packaging

Kivilahti, J.K.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1995

Language:

english

File:

PDF, 857 KB

english, 1995

26

[Microsystems] Interfacial Compatibility in Microelectronics || Interfacial Adhesion in Polymer Systems

Laurila, Tomi, Vuorinen, Vesa, Paulasto-Kröckel, Mervi, Turunen, Markus, Mattila, Toni T., Kivilahti, Jorma

Year:

2012

Language:

english

File:

PDF, 535 KB

english, 2012

27

Feasibility of Some Lead‐free Solder Alloys as Filler Materials for Z‐axis Adhesives

Savolainen, P., Kivilahti, J.

Journal:

Soldering & Surface Mount Technology

Year:

1995

Language:

english

File:

PDF, 306 KB

english, 1995

28

Expression of cell adhesion complexes in epithelial cells seeded on biomaterial surfaces

L. Räisänen, M. Könönen, J. Juhanoja, P. Varpavaara, J. Hautaniemi, J. Kivilahti, M. Hormia

Journal:

Journal of Biomedical Materials Research Part B: Applied Biomaterials

Year:

2000

Language:

english

File:

PDF, 1.18 MB

english, 2000

29

Reactive blending approach to modify spin-coated epoxy film: Part I. Synthesis and characterization of star-shaped poly(ϵ-caprolactone)

Markus P. K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Journal of Applied Polymer Science

Year:

2006

Language:

english

File:

PDF, 361 KB

english, 2006

30

Reactive blending approach to modify spin-coated epoxy film: Part II. Crosslinking kinetics

Markus P. K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Journal of Applied Polymer Science

Year:

2006

Language:

english

File:

PDF, 106 KB

english, 2006

31

Effect of surface processing on the attachment, orientation, and proliferation of human gingival fibroblasts on titanium

M. Köunönen, M. Hormia, J. Kivilahti, J. Hautaniemi, I. Thesleff

Journal:

Journal of Biomedical Materials Research Part B: Applied Biomaterials

Year:

1992

Language:

english

File:

PDF, 1.13 MB

english, 1992

32

Bonding of low-fusing dental porcelain to commercially pure titanium

M. Könönen, J. Kivilahti

Journal:

Journal of Biomedical Materials Research Part B: Applied Biomaterials

Year:

1994

Language:

english

File:

PDF, 1.04 MB

english, 1994

33

Interfacial reactions in the Si/TaC/Cu system

T. Laurila, J. Molarius, J.K. Kivilahti

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 480 KB

english, 2004

34

Analyses of interfacial reactions at different levels of interconnection

T. Laurila, V. Vuorinen, J.K. Kivilahti

Journal:

Materials Science in Semiconductor Processing

Year:

2004

Language:

english

File:

PDF, 835 KB

english, 2004

35

Chemical stability of Ta diffusion barrier between Cu and Si

T Laurila, K Zeng, J.K Kivilahti, J Molarius, I Suni

Journal:

Thin Solid Films

Year:

2000

Language:

english

File:

PDF, 367 KB

english, 2000

36

Reactive sputter deposition and properties of TaxN thin films

T Riekkinen, J Molarius, T Laurila, A Nurmela, I Suni, J.K Kivilahti

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 617 KB

english, 2002

37

Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems

T Laurila, K Zeng, J Molarius, T Riekkinen, I Suni, J.K Kivilahti

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 613 KB

english, 2002

38

Evaluation of the surface free energy of spin-coated photodefinable epoxy

Markus P. K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Journal of Polymer Science Part B: Polymer Physics

Year:

2002

Language:

english

File:

PDF, 242 KB

english, 2002

39

Surface modification of a liquid-crystalline polymer for copper metallization

J. Ge, M. P. K. Turunen, J. K. Kivilahti

Journal:

Journal of Polymer Science Part B: Polymer Physics

Year:

2003

Language:

english

File:

PDF, 871 KB

english, 2003

40

Reliability of lead-free interconnections under consecutive thermal and mechanical loadings

T. T. Mattila, J. K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 210 KB

english, 2006

41

Thermodynamic Evaluation of Solid-State Reactions in which a Volatile Product is Formed

Alexander A. Kodentsov, Jorma K. Kivilahti, Frans J. J. van Loo

Journal:

Monatshefte für Chemie - Chemical Monthly

Year:

2005

Language:

english

File:

PDF, 218 KB

english, 2005

42

A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnections

K. J. Rönkä, F. J. J. van Loo, J. K. Kivilahti

Journal:

Metallurgical and Materials Transactions A

Year:

1998

Language:

english

File:

PDF, 266 KB

english, 1998

43

Deformation behavior of dilute SnBi(0.5 to 6 at. pct) solid solutions

T. Reinikainen, J. Kivilahti

Journal:

Metallurgical and Materials Transactions A

Year:

1999

Language:

english

File:

PDF, 583 KB

english, 1999

44

Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems

K. Zeng, J. K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 751 KB

english, 2001

45

Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading

T. T. Mattila, J. K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 341 KB

english, 2005

46

Analysis of the redeposition of AuSn4on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders

T. Laurila, V. Vuorinen, T. Mattila, J. K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 466 KB

english, 2005

47

Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System

H. Yu, V. Vuorinen, J. K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 538 KB

english, 2007

48

Solid-State Reactions between Cu(Ni) Alloys and Sn

Vesa Vuorinen, Tomi Laurila, Toni Mattila, Erkki Heikinheimo, Jorma K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 539 KB

english, 2007

49

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNixMetallizations

V. Vuorinen, H. Yu, T. Laurila, J.K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 1.13 MB

english, 2008

50

Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling

J. Li, T. T. Mattila, J. K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 1.08 MB

english, 2010

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски